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Patent Searching and Data


Title:
JOINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/238809
Kind Code:
A1
Abstract:
This joining device is a device that joins a first joined object and a second joined object using laser light, and comprises a first stage, a pressurization mechanism, a second stage, and a laser light source. The first stage is a device which is transmissive to laser light and is positioned on the back surface side of the first joined object. The pressurization mechanism is a mechanism that applies a pressure to the back surface of the first joined object. The second stage has a pressure-receiving surface that receives the pressure of the pressurization mechanism on the back surface side of the second joined object. The laser light source irradiates a junction portion between the first joined object and the second joined object with laser light via the first stage. The pressurization mechanism is a mechanism in which a pressure transfer medium is composed of a gas or a liquid, and which applies the pressure to the back surface with the transfer medium in contact with the back surface of the first joined object.

Inventors:
IKAGAWA YOSHINORI (JP)
Application Number:
PCT/JP2023/020743
Publication Date:
December 14, 2023
Filing Date:
June 05, 2023
Export Citation:
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Assignee:
TAZMO CO LTD (JP)
International Classes:
H01L21/02; B23K20/00
Domestic Patent References:
WO2021039427A12021-03-04
Foreign References:
JP2022078625A2022-05-25
JP2005191556A2005-07-14
JP2019186265A2019-10-24
JPH01132113A1989-05-24
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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