BONDING PRETREATMENT METHOD FOR COMPOSITE MATERIAL

WIPO Patent Application WO/2021/010044

A1

The purpose of the present invention is to provide a bonding pretreatment method for a composite material, said method stabilizing the quality of a bonded part. The present disclosure is a pretreatment method for bonding a composite material to another member, wherein: (S2) an absorbent that is capable of absorbing a contaminant is bonded to the surface of a prepreg laminate which is a precursor of the composite body; (S3) the prepreg laminate is covered by a packaging material from above the absorbent; (S4) the inside of the packaging material is evacuated and the prepreg laminate is heated at a temperature that is lower than the curing temperature of the prepreg; (S5) the packaging material is removed after the step (S4); (S6) the absorbent is separated; (S7) a mold release member, which does not transfer silicone and fluorine to a resin, is bonded to the surface of the prepreg laminate, from said surface the absorbent having been separated; (S9) a composite material is formed by curing the prepreg after the step (S7); and (S11) the mold release member is separated from the composite material before bonding another member thereto.

JP2002284086	VEHICLE OR BOARD FOR NAVIGATION ON WATER AND MANUFACTURING METHOD OF THE SAME MANUFACTURED BY LAMINATING SHEET SHAPED FOAM WITH BUOYANCE BY ADHESION OR HEAT COMPRESSION, AND TIGHTENING END SURFACE BY BAND, CLOTH OR THE LIKE
WO/2015/051242	METHOD AND APPARATUS FOR ADHESION OF INSERTS
JPS62213693	MANUFACTURE OF HEAT EXCHANGER

AKIYAMA HIROMICHI (JP)
TAKAGI KIYOKA (JP)

PCT/JP2020/021956

January 21, 2021

June 03, 2020

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MITSUBISHI HEAVY IND LTD (JP)

B29C65/48

JP2016501145A	2016-01-18
JP2014015567A	2014-01-30
JPH10296765A	1998-11-10
JP2015508346A	2015-03-19

See also references of EP 3984725A4

FUJITA, Takaharu (JP)

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