Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BORON NITRIDE POWDER, HEAT DISSIPATION SHEET, AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2022/149435
Kind Code:
A1
Abstract:
This boron nitride powder includes at least aggregated boron nitride particles obtained by aggregating hexagonal boron nitride primary particles. The grain size distribution of the boron nitride powder has at least a first maxima (MAX1), a second maxima (MAX2) having a larger grain size than the first maxima, and a third maxima (MAX3) having a larger grain size than the second maxima. The grain size of the first maxima is at least 0.4 μm and less than 10 μm, the grain size of the second maxima is at least 10 μm and less than 40 μm, and the grain size of the third maxima is 40-110 μm (inclusive). This heat dissipation sheet is obtained by molding a thermally conductive resin composition that includes the boron nitride powder of the present invention and a resin. This method for producing a heat dissipation sheet includes a step for blending the boron nitride powder of the present invention and a resin to produce a thermally conductive resin composition, a step for molding the thermally conductive resin composition into the form of a sheet to produce a thermally conductive resin composition sheet, and a step for heating and pressurizing the thermally conductive resin composition sheet under vacuum. According to the present invention, it is possible to provide a boron nitride powder for obtaining a heat dissipation sheet having exceptional thermal conductivity, a heat dissipation sheet having exceptional thermal conductivity, and a method for producing a heat dissipation sheet having exceptional thermal conductivity.

Inventors:
WADA KOSUKE (JP)
FUJI KIYOTAKA (JP)
Application Number:
PCT/JP2021/046762
Publication Date:
July 14, 2022
Filing Date:
December 17, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C01B21/064; C08J5/18; C08K3/38; C08L101/00; C09K5/14
Domestic Patent References:
WO2020196643A12020-10-01
WO2012046814A12012-04-12
Foreign References:
JP2020164365A2020-10-08
JP2018526496A2018-09-13
JP2020169230A2020-10-15
JP2018043899A2018-03-22
JP2008189818A2008-08-21
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF: