Title:
HEAT DISSIPATION SHEET AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2022/149434
Kind Code:
A1
Abstract:
A heat dissipation sheet according to the present invention is obtained by molding a thermally conductive resin composition which contains a resin and a boron nitride powder that contains at least aggregated boron nitride particles, each of which is composed of aggregated hexagonal boron nitride primary particles; and this heat dissipation sheet has a partial discharge starting voltage of from 2,800 kV/mm to 5,000 kV/mm. A method for producing a heat dissipation sheet according to the present invention comprises: a step for forming a thermally conductive resin composition by blending a resin with a boron nitride powder that contains at least aggregated boron nitride particles, each of which is composed of aggregated hexagonal boron nitride primary particles; a step for forming a thermally conductive resin composition sheet by molding the thermally conductive resin composition into a sheet form; and a step for applying heat and pressure to the thermally conductive resin composition sheet under a vacuum. The present invention is able to provide: a heat dissipation sheet which has excellent thermal conductivity and insulation properties; and a method for producing a heat dissipation sheet which has excellent thermal conductivity and insulation properties.
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Inventors:
WADA KOSUKE (JP)
FUJI KIYOTAKA (JP)
FUJI KIYOTAKA (JP)
Application Number:
PCT/JP2021/046743
Publication Date:
July 14, 2022
Filing Date:
December 17, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/36; C08K3/38; C08L101/00; C09K5/14; H01L23/373; H05K7/20
Domestic Patent References:
| WO2018235920A1 | 2018-12-27 | |||
| WO2019164002A1 | 2019-08-29 |
Foreign References:
| JP2019029269A | 2019-02-21 | |||
| JP2011176024A | 2011-09-08 | |||
| JP2018052782A | 2018-04-05 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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