Title:
BRIDGES FOR MICROELECTROMECHANICAL STRUCTURES
Document Type and Number:
WIPO Patent Application WO2004000718
Kind Code:
A3
Abstract:
A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the 5 first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12).
Inventors:
MA QING
CHOU TSUNG-KUAN
CHOU TSUNG-KUAN
Application Number:
PCT/US2003/018306
Publication Date:
July 15, 2004
Filing Date:
June 10, 2003
Export Citation:
Assignee:
INTEL CORP (US)
International Classes:
B81C1/00; B81B7/00; B81B7/02; H01L21/3205; H01L21/768; H01L21/822; H01L23/52; H01L23/522; H01L23/66; H01L27/04; (IPC1-7): B81B7/00; H01L23/522
Foreign References:
| US5408742A | 1995-04-25 | |||
| US5148260A | 1992-09-15 | |||
| US4920323A | 1990-04-24 | |||
| US4670297A | 1987-06-02 | |||
| US3539705A | 1970-11-10 |
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