BROADBAND MEMS MICROPHONE STRUCTURE

WIPO Patent Application WO/2011/093584

A2

The present invention relates to a MEMS microphone which is capable of enhancing acoustic performance. According to the present invention, provided is a MEMS microphone comprising: a microphone chip and an ASIC chip which are mounted on a silicon substrate; a metal case which is installed so as to surround the microphone chip and ASIC chip, and thus to form an acoustic cavity which is formed with an acoustic hole so as to allow the inflow of sound; and a volume reduction member which is disposed within the metal case and reduces the volume of the acoustic cavity.

WO/2017/194580	MICROELECTROMECHANICAL SYSTEM (MEMS) COMPRISING MICROPHONE AND LOW POWER CIRCUITRY WITH DETECTION OF AUDIO SIGNAL
JP2016521036	A MEMS device which increased back capacity
JP3894564	LOUDSPEAKER MODULE FRAME, LOUDSPEAKER MODULE AND ELECTRONIC DEVICE PROVIDED WITH LOUDSPEAKER MODULE

PARK DU-YOUNG (KR)
KIM CHANG-WON (KR)
KIM JUNG-MIN (KR)

PCT/KR2010/008294

August 04, 2011

November 23, 2010

Click for automatic bibliography generation  

BSE CO LTD (KR)
PARK DU-YOUNG (KR)
KIM CHANG-WON (KR)
KIM JUNG-MIN (KR)

H04R19/04

KR20080071340A	2008-08-04
KR20080005801A	2008-01-15
KR100737726B1	2007-07-04
KR20060127166A	2006-12-11

YOON, Byung-Sam et al. (KR)
윤병삼 (KR)

View/Download PDF      PDF Help

Previous Patent: SHIELD ACTUATOR FOR HEAD LAMP IN THE VEHICLE

Next Patent: MEMBER MANAGEMENT METHOD USING GUILD SYSTEM AND CUSTOMER MARKETING SYSTEM