Title:
BUFFER STRUCTURE AND PREPARATION METHOD FOR SAME, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/246272
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of display. Disclosed are a buffer structure and a preparation method for same, and a display apparatus. The buffer structure comprises a substrate layer, wherein a plurality of microporous structures are distributed in the substrate layer; the substrate layer is doped with electrically and thermally conductive materials; the electrically and thermally conductive materials are distributed in the whole-layer structure of the substrate layer; and the electrically and thermally conductive materials form a heat conducting network structure in the substrate layer. The buffer structure has good performances in terms of buffering, heat dissipation and electromagnetic shielding, and is integrated with a plurality of functions, thereby being conducive in reducing the overall thickness of a screen. In addition, the preparation process for the buffer structure is simple and the production efficiency is high, such that the production costs of the display apparatus are reduced.
Inventors:
ZUO KAILONG (CN)
Application Number:
PCT/CN2023/089686
Publication Date:
December 28, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
B29C44/20; H10K59/10
Foreign References:
| CN115101695A | 2022-09-23 | |||
| CN107522942A | 2017-12-29 | |||
| CN114573858A | 2022-06-03 | |||
| CN111961305A | 2020-11-20 | |||
| CN113736130A | 2021-12-03 | |||
| US20180208762A1 | 2018-07-26 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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