Title:
SUPERCONDUCTING QUANTUM CHIP CONNECTION STRUCTURE, AND CONNECTION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/246271
Kind Code:
A1
Abstract:
The present invention relates to a superconducting quantum chip connection structure which is used for connection between superconducting quantum chips. The superconducting quantum chip comprises a quantum substrate and a quantum circuit. The connection structure comprises: a connecting portion, which is used for connecting the superconducting quantum chips; and a current conversion portion, which is arranged on the quantum substrate and used for connecting the quantum circuit and the connecting portion such that a standing wave current of a standing wave mode for communication is close to zero at a bonding interface . The present invention not only significantly reduces channel losses and realizes high-intensity coupling, but also significantly lowers the energy loss at the bonding interface, thereby reducing the impact on the efficiency of quantum state transmission.
Inventors:
ZHONG YOUPENG (CN)
LIU SONG (CN)
YU DAPENG (CN)
NIU JINGJING (CN)
ZHANG LIBO (CN)
LIU SONG (CN)
YU DAPENG (CN)
NIU JINGJING (CN)
ZHANG LIBO (CN)
Application Number:
PCT/CN2023/089663
Publication Date:
December 28, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
SHENZHEN INT QUANTUM ACADEMY (CN)
International Classes:
G06N10/20; G06N10/40
Foreign References:
| CN115204402A | 2022-10-18 | |||
| CN113537500A | 2021-10-22 | |||
| CN110277969A | 2019-09-24 | |||
| CN112074945A | 2020-12-11 | |||
| CN112561067A | 2021-03-26 | |||
| CN113242027A | 2021-08-10 | |||
| CN113394535A | 2021-09-14 | |||
| JPS63290979A | 1988-11-28 |
Attorney, Agent or Firm:
JEEKAI & PARTNERS et al. (CN)
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