CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Title:

CAMERA MODULE, MOLDING PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/038139

Kind Code:

A1

Abstract:

A camera module, a molding photosensitive assembly and a manufacturing method therefor, and an electronic device. The molding photosensitive assembly comprises an imaging assembly, a molding base, and a filter assembly. The imaging assembly comprises a circuit board and at least one photosensitive element, and each of the photosensitive elements is conductively connected to the circuit board. The molding base is provided with at least one stepped peripheral groove so as to define an optical window by means of the stepped peripheral groove, and the molding base covers a portion of the imaging assembly and a photosensitive area of each of the photosensitive elements corresponds to the optical window of the molding base, respectively. The filter assembly comprises at least one filter element, wherein each of the filter elements is correspondingly provided in the stepped peripheral groove of the molding base, so that each of the filter elements corresponds to the optical window of the molding base, respectively.

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Inventors:

HUANG ZHEN (CN)
MEI QIMIN (CN)
ZHAO BOJIE (CN)
MEI ZHEWEN (CN)
LIU LI (CN)
CHEN JIAWEI (CN)
YANG ZONGCHUN (CN)
XU CHENXIANG (CN)

Application Number:

PCT/CN2019/095337

Publication Date:

February 27, 2020

Filing Date:

July 10, 2019

Export Citation:

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Assignee:

NINGBO SUNNY OPOTECH CO LTD (CN)

International Classes:

H04N5/225

Foreign References:

CN105704354A	2016-06-22
CN102946512A	2013-02-27
CN107566691A	2018-01-09
US20180109709A1	2018-04-19

Other References: