Title:
CAMERA MODULE, MOULDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/188628
Kind Code:
A1
Abstract:
Provided are a camera module, a moulded photosensitive assembly and a manufacturing method therefor, and an electronic device. The moulded photosensitive assembly comprises a moulding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the moulding portion comprises a moulding portion body, the moulding portion body is made of a transparent material, and the moulding portion body, the photosensitive chip and the circuit board form an integral structure by means of a moulding technique, so as to facilitate production.
Inventors:
WANG MINGZHU (CN)
TANAKA TAKEHIKO (JP)
GUO NAN (CN)
CHEN ZHENYU (CN)
ZHAO BOJIE (CN)
TANAKA TAKEHIKO (JP)
GUO NAN (CN)
CHEN ZHENYU (CN)
ZHAO BOJIE (CN)
Application Number:
PCT/CN2018/082819
Publication Date:
October 18, 2018
Filing Date:
April 12, 2018
Export Citation:
Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/225
Foreign References:
| US20040179249A1 | 2004-09-16 | |||
| CN1606158A | 2005-04-13 | |||
| JP2004180116A | 2004-06-24 | |||
| CN105793988A | 2016-07-20 | |||
| CN103574520A | 2014-02-12 | |||
| CN101794768A | 2010-08-04 |
Other References:
See also references of EP 3611913A4
Attorney, Agent or Firm:
NINGBO RAYMOND IP AGENCY FIRM (CN)
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