Title:
CAMERA MODULE, SOLID-STATE IMAGING ELEMENT, ELECTRONIC DEVICE, AND IMAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/014071
Kind Code:
A1
Abstract:
This disclosure relates to a camera module, a solid-state imaging element, an electronic device, and an imaging method which enable camera shake and lens distortion to be effectively corrected.
An imaging unit captures an image of a subject by receiving light incident from the subject via an optical system, and a detection unit detects the motion of the imaging unit during a period of time when an image of at least one frame is captured by the imaging unit. Then, coordinate transformation processing for, on the basis of the motion of the imaging unit detected by the motion detection unit and a correction factor for correcting distortion of the optical system, collectively transforming coordinates on the image captured by the imaging unit such that the influence of both the shake of the imaging unit and the distortion of the optical system on the image is suppressed is performed. This technology is applicable, for example, to a stacked CMOS image sensor.
Inventors:
ISO DAISUKE (JP)
KUWAHARA SOICHI (JP)
YAMADA HIDESHI (JP)
KUWAHARA SOICHI (JP)
YAMADA HIDESHI (JP)
Application Number:
PCT/JP2016/070261
Publication Date:
January 26, 2017
Filing Date:
July 08, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H04N5/232; G03B5/00; G06T5/00
Foreign References:
| JP2011160067A | 2011-08-18 | |||
| JP2014064327A | 2014-04-10 | |||
| JP2006186884A | 2006-07-13 | |||
| JP2014203400A | 2014-10-27 | |||
| JP2012103741A | 2012-05-31 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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