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Patent Searching and Data


Title:
CAPACITOR AND METHOD FOR PRODUCING SAME, AND CAPACITOR-MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/246195
Kind Code:
A1
Abstract:
The present invention drastically reduces the occurrence of mounting failures when mounting a capacitor to a circuit board by reflow soldering. A capacitor in which a capacitor body, which is obtained by storing a capacitor element inside an outer case shaped like a cylinder which has a floor, sealing the open end of the outer case with a sealing member, and passing a lead terminal drawn from the capacitor element through the sealing member, is stored in a base which has a floor-surface section equipped with a through hole through which the lead terminal passes and also has a lateral wall formed so as to surround the outer-circumference of the capacitor body and to be provided with a projecting part which projects toward the capacitor body from the inner surface of the lateral wall, wherein the projecting part is positioned in a crimped section formed by crimping the lateral surface of the outer case, and a gap is provided between the crimped section and the projecting part.

Inventors:
KOBAYASHI KENTARO (JP)
Application Number:
PCT/JP2020/018473
Publication Date:
December 10, 2020
Filing Date:
May 01, 2020
Export Citation:
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Assignee:
NIPPON CHEMICON (JP)
International Classes:
H01G2/02; H01G2/06; H01G2/10; H01G9/00; H01G9/08; H01G9/12; H05K1/18
Foreign References:
JPH10199772A1998-07-31
JP2012074561A2012-04-12
JP2001102237A2001-04-13
JP2007317688A2007-12-06
JPH0964526A1997-03-07
JPH1187895A1999-03-30
JP2001217148A2001-08-10
JP2013235968A2013-11-21
JPS59149090A1984-08-25
JPH0661106A1994-03-04
JP2001102237A2001-04-13
Other References:
See also references of EP 3982383A4
Attorney, Agent or Firm:
HAMADA Haruo (JP)
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