Title:
CELL PACK
Document Type and Number:
WIPO Patent Application WO/2013/076911
Kind Code:
A1
Abstract:
A cell pack is provided with: a plurality of cells (1) that are connected to each other; a lead plate (5) comprising an electroconductive material connected to the plurality of cells (1); and a circuit board (3) connected to the plurality of cells (1) via the lead plate (5). An insertion hole (3A) perforating through the circuit board (3) in the thickness direction thereof is formed in the circuit board (3), and the lead plate (5) has an insertion part (5A) inserted into the insertion hole (3A), the insertion part (5A) being formed by folding so as to be thicker than other portions of the lead plate (5).
Inventors:
FUKUDA SHINSUKE
FUKUMOTO YASUMI
FUKUMOTO YASUMI
Application Number:
PCT/JP2012/006679
Publication Date:
May 30, 2013
Filing Date:
October 18, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
H01M50/529; H01M50/519
Foreign References:
| US20050271934A1 | 2005-12-08 | |||
| US20100178549A1 | 2010-07-15 | |||
| JP2005149747A | 2005-06-09 | |||
| JP2001093494A | 2001-04-06 | |||
| JP2005056721A | 2005-03-03 | |||
| JP2008287984A | 2008-11-27 | |||
| JP2011222484A | 2011-11-04 | |||
| JPS56148876U | 1981-11-09 | |||
| JP2009146873A | 2009-07-02 | |||
| JP2012049105A | 2012-03-08 | |||
| JP2012049133A | 2012-03-08 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Download PDF:
Claims: