CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

Title:

CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2018/135755

Kind Code:

A2

Abstract:

The present invention relates to a ceramic circuit board and a manufacturing method therefor, the ceramic circuit board comprising: an aluminum nitride substrate; a junction layer formed on the aluminum nitride substrate and containing a spinel structure of metal oxide; and a metal layer formed on the junction layer, wherein at least one of the junction layer and the metal layer contains glass frit.

Inventors:

PARK MI SO (KR)
KWAK MAN SUK (KR)
KIM KYONG HWAN (KR)
LEE SEUNG SANG (KR)

Application Number:

PCT/KR2017/014487

Publication Date:

July 26, 2018

Filing Date:

December 11, 2017

Export Citation:

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Assignee:

KCC CORP (KR)

International Classes:

H05K1/03; H05K3/02

Attorney, Agent or Firm:

BAE, KIM & LEE IP GROUP (KR)

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