CERAMIC WIRE AND BONDING METHOD THEREFOR - HANMI ELECTRIC WIRE CO LTD

Title:

CERAMIC WIRE AND BONDING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2016/175494

Kind Code:

A1

Abstract:

A ceramic wire and a bonding method therefor are disclosed. The bonding method for a ceramic wire comprises a step of bonding a lower wire, a bonding wire, and an upper wire by providing a lower solder between the lower wire and the bonding wire and providing an upper solder between the bonding wire and the upper wire.

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Inventors:

CHOI KYU HAN (KR)
RHO DERK JIN (KR)
SUNG BYUNG KYUNG (KR)

Application Number:

PCT/KR2016/004104

Publication Date:

November 03, 2016

Filing Date:

April 20, 2016

Export Citation:

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Assignee:

HANMI ELECTRIC WIRE CO LTD (KR)
SUNAM CO LTD (KR)

International Classes:

H01B12/00; H01B12/06; H01B13/00

Foreign References:

JPH09306565A	1997-11-28
JP2012004029A	2012-01-05
JP2010129465A	2010-06-10
JP2013243002A	2013-12-05
JP2011023237A	2011-02-03

Attorney, Agent or Firm:

KORYO IP&LAW (KR)
특허법인 고려 (KR)

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