Title:
A CHEMICAL-MECHANICAL POLISHING LIQUID
Document Type and Number:
WIPO Patent Application WO/2009/070967
Kind Code:
A1
Abstract:
A chemical-mechanical polishing liquid is disclosed, which comprises water,
silica doped by metal and one or more kinds of the following rate-accelerators:
organic acid, fluoride, ammonia, quaternary amine salts and the derivatives
thereof. The polishing liquid has higher polishing rate for TEOS, higher selection
ratio of removal rate for TEOS to one or more kinds material of SiN, BD, SiC and SiON.
The chemical-mechanical polishing liquid still attains higher polishing rate
for TEOS and better controlling ability for defect in the case of the lower content
of abrasive. So the cost is extremely reduced.
Inventors:
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
BAO BOB JIANXIN (CN)
WANG SHUMIN (CN)
YAO DAISY YING (CN)
BAO BOB JIANXIN (CN)
WANG SHUMIN (CN)
Application Number:
PCT/CN2008/001856
Publication Date:
June 11, 2009
Filing Date:
November 07, 2008
Export Citation:
Assignee:
ANJI MICROELECTRONICS SHANGHAI (CN)
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
BAO BOB JIANXIN (CN)
WANG SHUMIN (CN)
SONG PETER WEIHONG (CN)
YAO DAISY YING (CN)
BAO BOB JIANXIN (CN)
WANG SHUMIN (CN)
International Classes:
C09G1/02
Foreign References:
| CN101012356A | 2007-08-08 | |||
| US20070186484A1 | 2007-08-16 | |||
| JP2007266597A | 2007-10-11 | |||
| KR20060117696A | 2006-11-17 | |||
| CN101077961A | 2007-11-28 | |||
| CN101108952A | 2008-01-23 | |||
| CN101168647A | 2008-04-30 | |||
| CN101130665A | 2008-02-27 | |||
| CN101225282A | 2008-07-23 |
Attorney, Agent or Firm:
HANHONG LAW FIRM (New Huang Pu Financial BuildingNo. 61 East Nanjing Road, Shanghai 2, CN)
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