Title:
A CHEMICAL MECHANICAL POLISHING LIQUID
Document Type and Number:
WIPO Patent Application WO/2009/097737
Kind Code:
A1
Abstract:
A chemical mechanical polishing liquid which contains abrasive particles and water. The said polishing liquid further contains biguanides and azoles. The coexistence of biguanides and azoles produces synergistic effect and results in a significantly higher removal rate of polycrystal silicon.
Inventors:
WANG CARL CHEN (CN)
JING JUDY JIANFEN (CN)
YANG ANDY CHUNXIAO (CN)
JING JUDY JIANFEN (CN)
YANG ANDY CHUNXIAO (CN)
Application Number:
PCT/CN2009/000071
Publication Date:
August 13, 2009
Filing Date:
January 19, 2009
Export Citation:
Assignee:
ANJI MICROELECTRONICS SHANGHAI (CN)
WANG CARL CHEN (CN)
JING JUDY JIANFEN (CN)
YANG ANDY CHUNXIAO (CN)
WANG CARL CHEN (CN)
JING JUDY JIANFEN (CN)
YANG ANDY CHUNXIAO (CN)
International Classes:
C09K3/14; C09G1/02; H01L21/304
Foreign References:
| US20050066585A1 | 2005-03-31 | |||
| JP2004031443A | 2004-01-29 | |||
| CN101037585A | 2007-09-19 |
Attorney, Agent or Firm:
HANHONG LAW FIRM (New Huangpu Financial BuildingNo. 61 East Nanjing Road, Shanghai 2, CN)
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