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Title:
CHEMICAL MECHANICAL POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/050069
Kind Code:
A1
Abstract:
A chemical mechanical polishing system comprises: a front-end module (101), used to store and/or test a wafer; a plurality of polishing units (102, 103, 104, 105), disposed side by side and at least one thereof being adjacent to the front-end module; polishing robot arms (107, 109), disposed between the plurality of polishing units for transferring the wafer; post-cleaning units (108, 110), connected to both the polishing units and the front-end module and disposed such that the wafer is vertically handled during a cleaning process; and an intermediate robot arm (408), used to transfer the wafer sequentially between the polishing units and the post-cleaning units. The chemical mechanical polishing system has a high production efficiency, flexible process flow, better cleaning effect and compact structure due to the small volume of the post-cleaning units.

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Inventors:
XU ZHENJIE (CN)
CHEN XIANGYU (CN)
WANG JIAN (CN)
PANG LINGLING (CN)
SHEN PAN (CN)
WANG GUODONG (CN)
PEI ZHAOHUI (CN)
CHEN YINGSONG (CN)
ZHAO DEWEN (CN)
WANG TONGQING (CN)
LI KUN (CN)
LU XINCHUN (CN)
Application Number:
PCT/CN2017/101583
Publication Date:
March 22, 2018
Filing Date:
September 13, 2017
Export Citation:
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Assignee:
UNIV TSINGHUA (CN)
HWATSING TECH CO LTD (CN)
International Classes:
B24B37/10; H01L21/67
Foreign References:
CN206105604U2017-04-19
CN105047582A2015-11-11
CN101147233A2008-03-19
CN104979244A2015-10-14
US7229339B22007-06-12
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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