Title:
CHEMICAL MECHANICAL POLISHING TOOL, APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO2003022518
Kind Code:
A3
Abstract:
A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly (322) comprised of a central pad mount (326) on a central shaft. That central pad mount beneficially retains a center polishing pad (324). Also included is a ring polishing assembly (308) comprised of a ring pad mount (332) with a central aperture on a ring shaft with a central aperture. The ring pad mount (322) beneficially retains a ring polishing pad having a central aperture. The central polishing assembly (322) and the ring polishing assembly (308) beneficially rotate and move axially independently of one another. The apparatus includes the CMP polishing tool and a rotating polishing table (311). The method includes rotating a semiconductor wafer (304) on the rotating polishing table (311). Then, selectively and independently moving a solid center polishing pad having an axis of rotation and/or an axially aligned ring-shaped polishing pad into contact with the surface of the semiconductor wafer.
Inventors:
JEONG IN-KWON (US)
Application Number:
PCT/US2002/027550
Publication Date:
November 06, 2003
Filing Date:
August 30, 2002
Export Citation:
Assignee:
ORIOL INC (US)
JEONG IN-KWON (US)
JEONG IN-KWON (US)
International Classes:
B24B37/20; B24B41/047; (IPC1-7): B24B7/22; B24B7/17; B24B23/00; C23F3/00; H01L21/00; H01L21/306; B24C7/02
Foreign References:
| US6179695B1 | 2001-01-30 | |||
| US5804507A | 1998-09-08 | |||
| US4128968A | 1978-12-12 | |||
| US5399233A | 1995-03-21 | |||
| US5792709A | 1998-08-11 | |||
| US5800253A | 1998-09-01 | |||
| US5389032A | 1995-02-14 |
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