SLURRY DISTRIBUTOR FOR CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF USING THE SAME

WIPO Patent Application WO2003022519

A3

A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield. Optionally, the apparatus (100) further includes a dispenser (186) for dispensing a cleaning fluid before and/or after the wiper (180) to substantially eliminate buildup of deposits.

WO/2009/155137	IMPROVED GRINDER/POLISHER
WO/2000/002707	POLISHING PAD FOR A SEMICONDUCTOR SUBSTRATE
WO/2013/073202	POLISHING SYSTEM

KAJIWARA JIRO
MOLONEY GERARD
LIU JUN
YANG JUNSHENG
SALDANA ERNESTO
WALSH CORMAC
REYES ALEJANDRO

PCT/US2002/028787

January 22, 2004

September 09, 2002

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MULTI PLANAR TECHNOLOGIES INC (US)

B24B37/04; B24B57/02; H01L21/304; (IPC1-7): B24B1/00; B24B7/00

US5709593A	1998-01-20
US5997392A	1999-12-07
US6280299B1	2001-08-28
US6283840B1	2001-09-04
US6284092B1	2001-09-04
US6468134B1	2002-10-22

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