Title:
CHEMICAL-RESISTANT PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/228662
Kind Code:
A1
Abstract:
A composition for forming a protective film against a wet etchant for semiconductors, said composition containing: (A) a compound or a polymer having a reactive group capable of undergoing a cross-linking reaction in the presence of a curing agent; (B) a curing agent; (C) a compound having a hydroxy group and a hydroxy group and/or a carbonyl group; and (D) a solvent.
Inventors:
NISHITA TOKIO (JP)
KINOSHITA KAZUHIKO (JP)
KINOSHITA KAZUHIKO (JP)
Application Number:
PCT/JP2023/016224
Publication Date:
November 30, 2023
Filing Date:
April 25, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; C08K5/053; C08K5/13; C08K5/151; C08K5/3445; C08L61/04; C08L63/00; C08L101/02
Domestic Patent References:
| WO2022054853A1 | 2022-03-17 |
Foreign References:
| JP3918942B2 | 2007-05-23 | |||
| JP2018173520A | 2018-11-08 | |||
| JPS6256947A | 1987-03-12 | |||
| JP2007182531A | 2007-07-19 | |||
| JP2014153463A | 2014-08-25 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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