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Patent Searching and Data


Title:
CHEMICAL SOLUTION, METHOD FOR PREPARING CHEMICAL SOLUTION, AND METHOD FOR PROCESSING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/150990
Kind Code:
A1
Abstract:
The present invention provides: a chemical solution having excellent etching performance with respect to transition metal-containing substances and having excellent defect control performance; a method for preparing the chemical solution; and a method for processing a substrate. This chemical solution contains: one or more periodic acids selected from the group consisting of periodic acids and salts thereof; one or more first metal components selected from the group consisting of Ti and Zr; and water, wherein when the chemical solution contains one first metal component, the content of the one first metal component is 1 mass ppt to 100 mass ppm with respect to the total mass of the periodic acids, and when the chemical solution contains two first metal components, the content of each of the two first metal components is 100 mass ppm or less with respect to the total mass of the periodic acids, and the content of at least one of the two first metal components is at least 1 mass ppt with respect to the total mass of the periodic acids.

Inventors:
SUGIMURA NOBUAKI (JP)
TAKAHASHI TOMONORI (JP)
SEKI HIROYUKI (JP)
MIZUTANI ATSUSHI (JP)
Application Number:
PCT/JP2019/001452
Publication Date:
August 08, 2019
Filing Date:
January 18, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/308
Domestic Patent References:
WO2018021038A12018-02-01
Foreign References:
JP2001240985A2001-09-04
JP2016092101A2016-05-23
JP2012080128A2012-04-19
JPH0539586A1993-02-19
JP2015195376A2015-11-05
JP2008160134A2008-07-10
JP2004330056A2004-11-25
JP2007508692A2007-04-05
JP2012044118A2012-03-01
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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