Title:
CHIP, CHIP ASSEMBLY, AND IMAGING MATERIAL CARTRIDGE
Document Type and Number:
WIPO Patent Application WO/2024/041546
Kind Code:
A1
Abstract:
Disclosed are a chip (104), and a chip assembly (103) and an imaging material cartridge (10) having the chip. The chip is configured to be detachably mounted to an imaging device provided with a plurality of contact pins along with the imaging material cartridge. The chip comprises a substrate (1041) and a plurality of contact portions (1042, 1043) arranged on the substrate; the substrate has a first side and a second side opposite to each other; and the plurality of contact portions comprise front surface contact portions (1042) arranged on the first side and back surface contact portions (1043) arranged on the second side. When the imaging material cartridge is mounted at a predetermined position of the imaging device, the front surface contact portions are electrically connected to contact pins (91), and the back surface contact portions are electrically connected to contact pins by means of a conductor (107) outside the chip. Therefore, the degree of freedom of arrangement of the contact portions can be improved, and the chip can be miniaturized, such that the miniaturization of the chip assembly provided with the chip, the cartridge provided with the chip or the chip assembly, and the imaging device provided with the cartridge would be easily realized.
Inventors:
FAN WENYI (CN)
LIN DONGMING (CN)
LIN DONGMING (CN)
Application Number:
PCT/CN2023/114326
Publication Date:
February 29, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
E Z INK TECH CO LTD (CN)
International Classes:
B41J2/175; B41J2/01
Foreign References:
| CN101716854A | 2010-06-02 | |||
| CN106808807A | 2017-06-09 | |||
| CN102896902A | 2013-01-30 | |||
| CN104985934A | 2015-10-21 | |||
| CN207790033U | 2018-08-31 | |||
| JP2015044419A | 2015-03-12 |
Attorney, Agent or Firm:
ZHUHAI XUNJIE INTELLECTUAL PROPERTY AGENCY FIRM (CN)
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