Title:
CHIP COMPONENT MOUNTING STRUCTURE, AND MODULE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2014/097836
Kind Code:
A1
Abstract:
External terminals (22A, 22B) are disposed on a mounting surface of a chip component (21) at positions having a rotational symmetry of 180° to each other relative to the center point (CP) of the mounting surface of the chip component (21). The mounting surface of a substrate (11) is provided with: a first mounting terminal (12A) and a second mounting terminal (12B) disposed in first diagonal positions of a square represented by a two-dot chain line; and a third mounting terminal (12C) and a fourth mounting terminal (12D) disposed in second diagonal positions of the square. The first mounting terminal (12A) and the fourth mounting terminal (12D) are connected by a terminal connection part (13A), and the second mounting terminal (12B) and the third mounting terminal (12C) are connected by a terminal connection part (13B). The chip component (21) can be mounted in any of four directions rotated every 90 degrees, providing the same characteristics electrically.
Inventors:
MURAYAMA HIROMI (JP)
HIGASHIBATA KAZUAKI (JP)
KATO NOBORU (JP)
HIGASHIBATA KAZUAKI (JP)
KATO NOBORU (JP)
Application Number:
PCT/JP2013/081853
Publication Date:
June 26, 2014
Filing Date:
November 27, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/18; G06K19/07; G06K19/077; H01L21/822; H01L27/04; H01L23/12
Foreign References:
| JP2004086644A | 2004-03-18 | |||
| JP2008204346A | 2008-09-04 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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