Title:
RESIN MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/097835
Kind Code:
A1
Abstract:
A resin multilayer substrate (101) is provided with: a multilayer substrate main body (1) that comprises a plurality of resin layers (2), which are laminated thermoplastic resin layers, and has a silica exposed surface (20), in which silica is exposed, on one main surface (1u) of the unit where the plurality of thermoplastic resin layers are laminated; a component (3) that is mounted on the main surface (1u) of the multilayer substrate main body (1); and an encapsulation resin layer (23) that is mainly formed of a silicone resin and encapsulates the component (3) such that at least a part of the encapsulation resin layer (23) is in contact with the silica exposed surface (20) on the main surface (1u).
Inventors:
CHISAKA SHUNSUKE (JP)
Application Number:
PCT/JP2013/081846
Publication Date:
June 26, 2014
Filing Date:
November 27, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H05K3/28
Domestic Patent References:
| WO2006093293A1 | 2006-09-08 |
Foreign References:
| JP2012209320A | 2012-10-25 | |||
| JPH0832214A | 1996-02-02 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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