Title:
CHIP-EMBEDDED CIRCUIT BOARD, COMBINED SENSOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/113697
Kind Code:
A1
Abstract:
A chip-embedded circuit board (10), a combined sensor (100) using the chip-embedded circuit board (10), and an electronic device using the combined sensor (100). The chip-embedded circuit board (10) comprises a substrate circuit board (11), a first ASIC chip (13) and a second ASIC chip (15). The first ASIC chip (13) and the second ASIC chip (15) are provided inside the substrate circuit board (11), and are spaced apart from each other. In the substrate circuit board (11), an interference prevention hole (17) is arranged between the first ASIC chip (13) and the second ASIC chip (15). The above structure aims to reduce electromagnetic interference between two adjacent chips inside the chip-embedded circuit board (10).
Inventors:
WANG DEXIN (CN)
QIU WENRUI (CN)
YANG JUNWEI (CN)
PAN XINCHAO (CN)
DUANMU LUYU (CN)
QIU WENRUI (CN)
YANG JUNWEI (CN)
PAN XINCHAO (CN)
DUANMU LUYU (CN)
Application Number:
PCT/CN2018/122919
Publication Date:
June 11, 2020
Filing Date:
December 22, 2018
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
B81B7/00
Foreign References:
| CN208094792U | 2018-11-13 | |||
| CN103137609A | 2013-06-05 | |||
| CN101150122A | 2008-03-26 | |||
| CN104779214A | 2015-07-15 | |||
| US20130075879A1 | 2013-03-28 |
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