Title:
CHIP FUSE AND CHIP FUSE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2017/130306
Kind Code:
A1
Abstract:
A chip fuse (1) is provided with: a casing (5) which includes an insulating resin as a base material and which forms a sealed space (6); a fusible body (30) which is provided in the sealed space (6) in a state of being hanged and supported in the air and which includes nickel as the base material; and a pair of terminals (40, 50) which have a structure that is integrated with the casing (5) so that a portion of the terminals is exposed from the casing (5), and which are electrically connected to both end sections of the fusible body (30).
Inventors:
ARIKAWA HIROO (JP)
OGAWA TOSHITAKA (JP)
KOMIYAMA YUKI (JP)
ASAI CHIHIRO (JP)
YAMAMOTO MASAO (JP)
OGAWA TOSHITAKA (JP)
KOMIYAMA YUKI (JP)
ASAI CHIHIRO (JP)
YAMAMOTO MASAO (JP)
Application Number:
PCT/JP2016/052241
Publication Date:
August 03, 2017
Filing Date:
January 27, 2016
Export Citation:
Assignee:
SOC CORP (JP)
International Classes:
H01H85/175; H01H69/02
Foreign References:
| JP2008052961A | 2008-03-06 | |||
| JP2003281985A | 2003-10-03 | |||
| JPH0963455A | 1997-03-07 | |||
| JPH02174189A | 1990-07-05 | |||
| JPH08148798A | 1996-06-07 | |||
| JP2005110325A | 2005-04-21 | |||
| JP2002093304A | 2002-03-29 | |||
| JP2005026036A | 2005-01-27 |
Attorney, Agent or Firm:
IZUMI, Michihiro et al. (JP)
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