Title:
CHIP PACKAGING STRUCTURE, METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/062140
Kind Code:
A1
Abstract:
Disclosed are a chip packaging structure, a method, and an electronic device, relating to the technical field of chip packaging. The chip packaging structure comprises a substrate, a connector, an image sensing module and an auxiliary module, and the image sensing module and the auxiliary module are integrally packaged by means of the substrate; the image sensing module comprises an image sensing chip, and the image sensing chip is packaged on a first surface of the substrate; the auxiliary module comprises at least one optical auxiliary chip, and the at least one optical auxiliary chip is packaged on a second surface of the substrate, and is electrically connected to the image sensing chip by means of the substrate; and the connector is connected to the substrate for electrically connecting the chip packaging structure to an external unit. The embodiments of the present disclosure can improve the integration of a chip packaging module and reduce the total volume of the module.
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Inventors:
WU BAOQUAN (CN)
JIANG WANLI (CN)
JIANG WANLI (CN)
Application Number:
PCT/CN2018/108625
Publication Date:
April 02, 2020
Filing Date:
September 29, 2018
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L27/146
Foreign References:
| CN107133556A | 2017-09-05 | |||
| CN206179849U | 2017-05-17 | |||
| CN104576563A | 2015-04-29 | |||
| US20170207182A1 | 2017-07-20 |
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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