Title:
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/142864
Kind Code:
A1
Abstract:
Provided are a chip packaging structure and a chip packaging method. The chip packaging structure comprises a substrate, a metal bonding pad arranged on the substrate, and a metal wire, wherein the terminal end of the metal wire is provided with a bonding portion; the bonding portion is bonded to the metal bonding pad; the metal bonding pad is provided with a coating layer; and at least part of the bonding portion is located between the coating layer and the metal bonding pad. According to the present invention, the bonding effect of the metal wire and the metal bonding pad is greatly improved in order to achieve more reliable and stable bonding therebetween.
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| WO/2009/030409 | METHOD FOR PRODUCING A SOLAR CELL |
Inventors:
HUANG WENJIE (CN)
Application Number:
PCT/CN2021/132271
Publication Date:
July 07, 2022
Filing Date:
November 23, 2021
Export Citation:
Assignee:
CHIPMORE TECH CORPORATION LIMITED (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
HEFEI CHIPMORE TECH CO LTD (CN)
International Classes:
H01L23/482; H01L23/488; H01L23/49; H01L23/60
Foreign References:
| CN107731772A | 2018-02-23 | |||
| CN112670257A | 2021-04-16 | |||
| CN107946201A | 2018-04-20 | |||
| CN106816417A | 2017-06-09 | |||
| CN103811446A | 2014-05-21 | |||
| US20010017412A1 | 2001-08-30 |
Attorney, Agent or Firm:
SUZHOU WISPRO INTELLECTUAL PROPERTY AGENCY (CN)
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