Title:
CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/103747
Kind Code:
A1
Abstract:
Disclosed is a chip packaging structure. A packaging substrate (12) with a through hole is used to package a chip. A first chip (11) is arranged in the through hole, the first chip (11) and the packaging substrate (12) are fixed by means of a first plastic packaging layer (13), and a second plastic packaging layer (14) covers a second surface, a back surface of the first chip (11) and the first plastic packaging layer (13) in the through hole, such that the packaging structure is formed, and the device structure is simple. The first chip (11) can be electrically connected to an external circuit by means of first contact ends (121) of the packaging substrate (12), such that the electrical connection between the first chip (11) and the external circuit is facilitated. In addition, the second plastic packaging layer (14) bears the first chip (11) and the first plastic packaging layer (13) in the through hole, such that when a side, close to a front surface of the first chip (11), of the packaging structure is subjected to pressure, the pressure can be buffered by means of the second plastic packaging layer (14), and therefore, the problem of failures, caused by the pressure, at the junction between the periphery of the back surface of the first chip (11) and the second plastic packaging layer (14) is avoided.
Inventors:
WANG ZHIQI (CN)
ZHANG CHENG (CN)
ZHANG CHENG (CN)
Application Number:
PCT/CN2019/118167
Publication Date:
May 28, 2020
Filing Date:
November 13, 2019
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L21/56; H01L23/31; H01L23/488
Foreign References:
| CN109494163A | 2019-03-19 | |||
| CN108447842A | 2018-08-24 | |||
| CN108257921A | 2018-07-06 | |||
| CN101587847A | 2009-11-25 | |||
| CN106415823A | 2017-02-15 | |||
| US20090102066A1 | 2009-04-23 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
Download PDF:
Previous Patent: CHIP PACKAGING STRUCTURE, AND PACKAGING METHOD
Next Patent: CHIP PACKAGING STRUCTURE AND METHOD
Next Patent: CHIP PACKAGING STRUCTURE AND METHOD