CHIP RESISTOR MANUFACTURING METHOD, AND CHIP RESISTOR

WIPO Patent Application WO/2018/147014

A1

According to the present invention, a chip resistor, which has a resistance of a predetermined value, is manufactured by the following method. A resistor, which has a wide portion and a narrow portion extending from the wide portion and having a smaller width than the wide portion, is provided on the top surface of an insulation substrate. A first electrode and a second electrode are provided on the top surface of the insulation substrate, wherein the first electrode is spaced apart from the wide portion, contacts the narrow portion, and overlaps with the narrow portion when viewed from above, and the second electrode contacts the resistor and overlaps with the resistor when viewed from above. The distance between the wide portion and the narrow portion is determined so that the resistance between the first electrode and the second electrode becomes the predetermined value. Through this manufacturing method, the accuracy of the resistance of the chip resistor can be improved.

JP2670825	[Title of Invention] Laser trimming simulation method
JPS58108763	METHOD OF TRIMMING LASER DIE PLATE FOR CIRCUIT ELEMENT
JPH01225301	THICK-FILM PRINTED RESISTANCE CIRCUIT DEVICE AND ITS MANUFACTURE

YAMADA KOICHI
NAKAYAMA SHOGO

PCT/JP2018/001116

August 16, 2018

January 17, 2018

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PANASONIC IP MAN CO LTD (JP)

H01C17/24; H01C1/142; H01C7/00

JPS6070753A	1985-04-22
JP2016072298A	2016-05-09

KAMATA Kenji et al. (JP)

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