Title:
CHIP TEST ASSEMBLY, CHIP TEST SYSTEM AND CHIP TEST METHOD
Document Type and Number:
WIPO Patent Application WO/2022/143037
Kind Code:
A1
Abstract:
A chip test assembly, a chip test system and chip test method. The chip test assembly comprises a test sub-board (10) and a performance test mainboard (20); the test sub-board (10) comprises a chip loading region (12) and a test connection region (13), the chip loading region (12) is used for loading a chip to be tested, and a mainboard connector is provided on the test connection region (13); the performance test mainboard (20) comprises a mainboard substrate (21), and a sub-board connector (22) and a signal transmission port provided on the mainboard substrate (21), and the signal transmission port is electrically connected to the sub-board connector (22) by means of a signal connection line (25); and when the sub-board connector (22) on the performance test mainboard (20) is attached to the mainboard connector on the test connection region (13) in the test sub-board (10), the signal transmission port is electrically connected to the chip on the test sub-board (10). The chip test assembly is helpful to ensure test accuracy and reduce test costs.
Inventors:
LIN KAIHUI (CN)
NI JIANXING (CN)
NI JIANXING (CN)
Application Number:
PCT/CN2021/136082
Publication Date:
July 07, 2022
Filing Date:
December 07, 2021
Export Citation:
Assignee:
RADROCK SHENZHEN TECH CO LTD (CN)
International Classes:
G01R31/28
Foreign References:
CN112834909A | 2021-05-25 | |||
CN104865412A | 2015-08-26 | |||
CN207366693U | 2018-05-15 | |||
CN109765481A | 2019-05-17 | |||
US20030101394A1 | 2003-05-29 | |||
CN208568976U | 2019-03-01 | |||
CN101109784A | 2008-01-23 | |||
CN211206712U | 2020-08-07 | |||
CN109061236A | 2018-12-21 |
Attorney, Agent or Firm:
SHENZHEN ZHONGDINGHUICHENG INTELLCCTUAL PROPERTY AGENCY (CN)
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