CHIP-TO-CHIP WAVEGUIDE AND CONTACTLESS CHIP-TO-CHIP COMMUNICATION

Title:

CHIP-TO-CHIP WAVEGUIDE AND CONTACTLESS CHIP-TO-CHIP COMMUNICATION

Document Type and Number:

WIPO Patent Application WO/2024/025530

Kind Code:

A8

Abstract:

A wireless chip-to-chip device includes a first semiconductor substrate comprising a first antenna, configured to emit a radiofrequency signal; a second semiconductor substrate comprising a second antenna and configured to receive the radiofrequency signal; and a waveguide, positioned between the first semiconductor substrate and the second semiconductor substrate.

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Inventors:

YANG TAE YOUNG (US)
ACIKALIN TOLGA (US)
KIPNIS ISSY (US)
RAHMAN MEHNAZ (US)
DOGIAMIS GEORGIOS (US)
HORINE BRYCE (US)

Application Number:

PCT/US2022/038612

Publication Date:

March 07, 2024

Filing Date:

July 28, 2022

Export Citation:

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Assignee:

INTEL CORP (US)

International Classes:

H01L23/66; H01L23/29; H01L25/065; H01P3/08; H04B5/00

Attorney, Agent or Firm:

VON RUEDEN, Benjamin, L. (US)

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