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Title:
STRIP LINE DEVICE, MEMBER TO BE MOUNTED ON PRINTED WIRING BOARD, CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND ITS FABRICATING METHOD
Document Type and Number:
WIPO Patent Application WO/2004/023597
Kind Code:
A1
Abstract:
Electromagnetic waves leaking from a power distribution circuit provided on a printed wiring substrate or in a semiconductor package are suppressed, and degradation of the waveform of a signal generated by a high-speed digital circuit. A strip line device comprises an elongated metal plate (10) having a valve action and coated with a dielectric film (20). A conductive layer (30) is formed to cover the valve-acting metal, with the dielectric film (20) interposed therebetween. The characteristic impedance as seen from its input terminal can be low over a wide range.

Inventors:
TOHYA HIROKAZU (JP)
MASUDA KOICHIRO (JP)
SHIMIZU HIDEKI (JP)
Application Number:
PCT/JP2003/011209
Publication Date:
March 18, 2004
Filing Date:
September 02, 2003
Export Citation:
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Assignee:
NEC CORP (JP)
TOHYA HIROKAZU (JP)
MASUDA KOICHIRO (JP)
SHIMIZU HIDEKI (JP)
International Classes:
H01G9/012; H01L23/50; H01L23/66; H01P3/08; H05K3/22; H05K1/02; (IPC1-7): H01P3/08; H01G4/00; H01G9/00
Foreign References:
JP2002164760A2002-06-07
JPH09134618A1997-05-20
JPH1050554A1998-02-20
JP2000150304A2000-05-30
JPH03167816A1991-07-19
JP2001223140A2001-08-17
JPH11219847A1999-08-10
JP2002184651A2002-06-28
JPH10108361A1998-04-24
JP2001119154A2001-04-27
JPS59132629U1984-09-05
JP2003101311A2003-04-04
JP2003124066A2003-04-25
Attorney, Agent or Firm:
Maruyama, Takao c/o Maruyama, Patent Office (SAM Build. 3floor 38-23, Higashi-Ikebukuro 2-chom, Toshima-ku Tokyo, JP)
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