Title:
CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/195523
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a chip-type ceramic electronic component having an external electrode structure which can reduce electrical resistance to a greater extent than a resin electrode while protecting a ceramic body from cracks against stress caused by board deflection, etc. An external electrode (11) includes a glass-free sintered layer (12) that does not contain glass. A glass-free conductive paste, which contains a nickel powder, a metal (e.g., tin) powder having a melting point of lower than 500°C, and a thermosetting resin, but does not contain glass, is prepared, the glass-free conductive paste is applied to cover a portion of the surface of a ceramic body (3), and then the ceramic body (3) coated with the glass-free conductive paste is heat-treated at a temperature, which is 400°C higher than the curing temperature of the thermosetting resin, for example at 850°C. By heat treatment, the thermosetting resin is thermally decomposed or burned, leaving almost no residue, and the nickel powder and the metal powder having a melting point of lower than 500°C are sintered to form an integrated metal sintered body (13).
Inventors:
ZENZAI KOTA (JP)
Application Number:
PCT/JP2020/008132
Publication Date:
October 01, 2020
Filing Date:
February 27, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Foreign References:
| JP2018098327A | 2018-06-21 | |||
| JPH05290622A | 1993-11-05 | |||
| JP2015109411A | 2015-06-11 |
Attorney, Agent or Firm:
KOSHIBA, Masaaki (JP)
Download PDF: