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Patent Searching and Data


Title:
CHUCK APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/157014
Kind Code:
A1
Abstract:
[Problem] To provide a chuck apparatus, which is capable of chucking a workpiece with an optimum holding force, irrespective of the weight and shape of the workpiece, and which is capable of dechucking the workpiece without damaging the workpiece. [solution] This chuck apparatus is provided with a base (1) and a chuck layer (2). The base (1) is configured from four concentrically disposed movable members (11-14), and the base can be vertically driven by means of four actuators (31-34). The chuck layer (2) is configured from an electrostatic attraction layer (21), and adhesive pads (22, 24). The electrostatic attraction layer (21) is adhered to the movable member (11), and the ring-like adhesive pads (22, 24) are adhered to the movable members (12, 14), respectively. A non-adhesive pad (23) is adhered to the movable member (13). The electrostatic attraction layer (21) is configured from an attraction electrode (25) and a dielectric body (26), and is capable of applying a voltage of a power supply (27) to the attraction electrode (25).

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Inventors:
SUZUKI RYUTA (JP)
TATSUMI YOSHIAKI (JP)
Application Number:
PCT/JP2014/057922
Publication Date:
October 02, 2014
Filing Date:
March 21, 2014
Export Citation:
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Assignee:
CREATIVE TECH CORP (JP)
International Classes:
H01L21/683; B23Q3/15; H02N13/00
Domestic Patent References:
WO2009013803A12009-01-29
Foreign References:
JP2001291763A2001-10-19
JP2003520416A2003-07-02
JPH04162422A1992-06-05
JP2007121474A2007-05-17
JP2007073802A2007-03-22
JP2013033850A2013-02-14
Attorney, Agent or Firm:
TSUKAHARA Takakazu (JP)
Takakazu Tsukahara (JP)
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