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Title:
CHUCK DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/139834
Kind Code:
A1
Abstract:
A chuck device (2) is configured to hold a wafer (W) during planarization of the wafer employing anodization. The chuck device includes a chuck cover (22), a suction section (23), and an energization section (24). The suction section (23) includes a suction surface (20) that sucks the wafer (W). The energization section (24) is provided in the suction section (23) to come into contact with the wafer (W) sucked by the suction section (23) to energize the wafer (W). The chuck cover (22) covers the suction section (23) and the energization section (24) in an insulated manner, while exposing the suction surface (20).

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Inventors:
HORI KANTARO (JP)
SOLTANI BAHMAN (JP)
AOKI KAZUFUMI (JP)
MARUNO NAOKI (JP)
KATO YUYA (JP)
YAMAMURA KAZUYA (JP)
YANG XU (JP)
Application Number:
PCT/JP2022/033153
Publication Date:
July 27, 2023
Filing Date:
September 02, 2022
Export Citation:
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Assignee:
DENSO CORP (JP)
UNIV OSAKA (JP)
International Classes:
H01L21/304; B23Q3/08; B24B1/00; B24B41/06; H01L21/683
Foreign References:
JP2010251699A2010-11-04
JP2020011353A2020-01-23
JP2003205455A2003-07-22
JP2021027359A2021-02-22
JP2018141188A2018-09-13
JP2009125825A2009-06-11
JP2005317625A2005-11-10
US20090277802A12009-11-12
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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