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Title:
CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND METHOD FOR MANUFACTURING PHOTOSENSITIVE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2020/024830
Kind Code:
A1
Abstract:
The present application provides a photosensitive assembly, comprising: a photosensitive chip; a flexible board having a through hole corresponding to a photosensitive region, the flexible board having a plurality of flexible board electrodes; and a rewiring layer comprising a filling layer formed on the surface of the flexible board, metal posts formed on the surfaces of the flexible board electrodes and covered by the filling layer, a rewiring layer wire covered by the filling layer, and a plurality of rewiring layer electrodes exposed outside the filling layer and conductively connected to the flexible board electrodes by means of the rewiring layer wire and the metal posts. The photosensitive chip is attached to the rewiring layer, and the plurality of rewiring layer electrodes respectively contact with and is conductively connected to a plurality of chip electrodes of the photosensitive chip in one-to-one correspondence fashion. The present application further provides a corresponding circuit board assembly, a camera module, and a method for manufacturing a photosensitive assembly. The present application can implement the highly hermetic packaging of a photosensitive chip of a camera module and can implement high I/O count packaging.

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Inventors:
HUANG ZHEN (CN)
WANG MINGZHU (CN)
ZHAO BOJIE (CN)
TANAKA TAKEHIKO (CN)
CHEN ZHENYU (CN)
GUO NAN (CN)
Application Number:
PCT/CN2019/097055
Publication Date:
February 06, 2020
Filing Date:
July 22, 2019
Export Citation:
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Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/225; H01L27/146
Foreign References:
CN107068625A2017-08-18
CN101266990A2008-09-17
CN204424252U2015-06-24
CN208768159U2019-04-19
JP2009283738A2009-12-03
Attorney, Agent or Firm:
INSIGHT INTELLECTUAL PROPERTY LIMITED (CN)
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