Title:
CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/111256
Kind Code:
A1
Abstract:
Provided is a circuit board in which a high bond strength can be obtained between an insulating substrate that contains AlN (aluminum nitride) and a Cu (copper)-based conductor layer. The circuit board comprises the insulating substrate that contains AlN, the conductor layer that contains Cu, and an intermediate layer that is located between the insulating substrate and the conductor layer. The intermediate layer has a first region that is close to the insulating substrate and a second region that is close to the conductor layer, wherein the second region has a Cu concentration that is higher than that of the first region and the first region has an Al concentration that is higher than that of the second region.
Inventors:
YAMASHITA KYOHEI (JP)
HOSOI YOSHIHIRO (JP)
HOSOI YOSHIHIRO (JP)
Application Number:
PCT/JP2019/046867
Publication Date:
June 04, 2020
Filing Date:
November 29, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H05K1/09; H05K3/38; H05K1/03
Foreign References:
| JPH05218229A | 1993-08-27 | |||
| JP2016058706A | 2016-04-21 | |||
| JPS60177634A | 1985-09-11 |
Other References:
See also references of EP 3890006A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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