Title:
CIRCUIT BOARD, PACKAGE FOR MOUNTING ELECTRONIC PARTS, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/111257
Kind Code:
A1
Abstract:
A circuit board 1 according to the present invention comprises a dielectric substrate 2 and a pair of differential signal transmission lines 3, 4. The pair of differential signal transmission lines 3, 4 includes a first transmission line 3 and a second transmission line 4. The first transmission line 3 has a first end 3a and a second end 3b, and the second transmission line 4 has a third end 4a and a fourth end 4b. The second end 3b has a first connection region 30 and an adjoining comb teeth-shaped first region 31. The fourth end 4b has a second connection region 40 that is located opposite the first connection region 30 and is connected to the first connection region 30 via an electronic part, and an adjoining second region 41. The first region 31 and the second region 41 are located spaced apart and meshed with each other.
Inventors:
SHIRASAKI TAKAYUKI (JP)
Application Number:
PCT/JP2019/046868
Publication Date:
June 04, 2020
Filing Date:
November 29, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H01L23/12; H01S5/02218; G02F1/01
Foreign References:
| JP2006216839A | 2006-08-17 | |||
| JP2008226988A | 2008-09-25 | |||
| JP2007225904A | 2007-09-06 | |||
| JP2015175960A | 2015-10-05 |
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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