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Patent Searching and Data


Title:
CIRCUIT BOARD AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/179196
Kind Code:
A1
Abstract:
A circuit board and an electronic device. The circuit board comprises a first line board, which comprises a first substrate and a first line layer arranged on a first side face of the first substrate, the first line layer comprising a first ground line. The circuit board further comprises a first protective layer and a first electromagnetic interference shielding layer, which are sequentially stacked on the side of the first line layer that is away from the first substrate, wherein the first protective layer is provided with a first opening; at least a part of the first ground line is exposed from the first opening; and the first opening is filled with a first conductive material, with the height difference between the surface of the first conductive material and the surface of the first protective layer that is away from the first substrate being 0 to 2 microns, and the first electromagnetic interference shielding layer is connected to the first ground line by means of the first conductive material.

Inventors:
PU QIANLIN (CN)
LI FEI (CN)
WANG ZIJIAN (CN)
LU XU (CN)
Application Number:
PCT/CN2021/130803
Publication Date:
September 01, 2022
Filing Date:
November 16, 2021
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
CHENGDU BOE OPTOELECT TECH CO (CN)
International Classes:
H05K1/02
Foreign References:
CN112822834A2021-05-18
CN207995488U2018-10-19
CN111465175A2020-07-28
CN109496063A2019-03-19
US20200367393A12020-11-19
Attorney, Agent or Firm:
AFD CHINA INTELLECTUAL PROPERTY LAW OFFICE (CN)
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