Title:
CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/053565
Kind Code:
A1
Abstract:
Provided is a circuit board manufacturing method that enables a carrier to be easily and reliably peeled. This circuit board manufacturing method comprises: a step for preparing a laminated sheet having a peeling layer and a wiring layer in sequence on a carrier; a step for forming a break or a gap, between the wiring layer and the carrier, to serve as a peel start point; a step for inserting, with respect to the peel start point, a rigid plate having an elongated section, the plate being inserted from the elongated section and the elongated section being longer than the width of the laminated sheet; and a step for shifting the rigid plate from the peel start point and along the peeling layer, to advance peeling of the wiring layer from the carrier. The flexural modulus of the wiring layer at 25°C measured in accordance with JIS K6911-1995 is between 0.3 GPa and 300 GPa.
Inventors:
KOMIYA MIKIKO (JP)
NAKAMURA TOSHIMI (JP)
KITABATAKE YUKIKO (JP)
MATSUURA YOSHINORI (JP)
NAKAMURA TOSHIMI (JP)
KITABATAKE YUKIKO (JP)
MATSUURA YOSHINORI (JP)
Application Number:
PCT/JP2023/031958
Publication Date:
March 14, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H01L23/12; B65H41/00; H05K3/46
Domestic Patent References:
| WO2015012268A1 | 2015-01-29 | |||
| WO2022102182A1 | 2022-05-19 |
Foreign References:
| JP2019140150A | 2019-08-22 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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