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Title:
PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053564
Kind Code:
A1
Abstract:
This photosensitive resin composition contains a polyimide (A) having an imide ring structure in the molecule, and a photosensitizer (B), and the water content measured by the Karl Fischer method is 0.30-10 mass% inclusive.

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Inventors:
TANAKA YUMA (JP)
KAWASAKI RITSUYA (JP)
Application Number:
PCT/JP2023/031925
Publication Date:
March 14, 2024
Filing Date:
August 31, 2023
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/004; G03F7/037; G03F7/075
Domestic Patent References:
WO2022145136A12022-07-07
Foreign References:
JP2022019609A2022-01-27
JP2021162834A2021-10-11
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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