Title:
CIRCUIT BOARD, METHOD FOR DESIGNING CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/065494
Kind Code:
A1
Abstract:
This circuit board (1) that has an upper surface on which a semiconductor module is mounted and a lower surface on which connection terminals (14) are provided is configured such that at least some of the connection terminals (14) are provided with connection pins. The connection terminals (14) include: a drive terminal (14D) for driving the semiconductor module; and a function terminal (14F) for connecting the semiconductor module to another function unit. The respective positions of the drive terminals (14D) in divided regions (D1-D4), which are obtained by dividing the circuit board (1) into quarters, are symmetric with respect to the center (O) of the circuit board (1).
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Inventors:
NARUSE TAKANOBU (JP)
Application Number:
PCT/JP2018/035026
Publication Date:
April 04, 2019
Filing Date:
September 21, 2018
Export Citation:
Assignee:
AISIN AW CO (JP)
International Classes:
H01L23/12
Domestic Patent References:
| WO2002103793A1 | 2002-12-27 |
Foreign References:
| JP2015041647A | 2015-03-02 |
Other References:
See also references of EP 3651192A4
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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