CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

Title:

CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2024/005101

Kind Code:

A1

Abstract:

[Problem] The present invention addresses the problem of providing a circuit board wherein a small-diameter via hole is formed as designed, and the via hole has excellent adhesion to a copper plating layer without requiring wet desmearing. [Solution] A circuit board according to the present invention comprises an insulating layer that is provided with a via hole, and this circuit board is characterized in that: the insulating layer is formed of a cured product of a thermosetting resin composition that contains a thermosetting resin and an inorganic filler; the opening diameter at the top of the via hole is 30 µm or less; and the manganese content in the insulating layer is less than 50 ppm.

Inventors:

KOH MEITEN (JP)
YONEDA KAZUYOSHI (JP)
NAKADA KAZUTAKA (JP)

Application Number:

PCT/JP2023/024045

Publication Date:

January 04, 2024

Filing Date:

June 28, 2023

Export Citation:

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Assignee:

TAIYO HOLDINGS CO LTD (JP)

International Classes:

H05K1/03; B23K26/382; H05K3/00; H05K3/42

Foreign References:

JP2003285176A	2003-10-07
JP2019026879A	2019-02-21
JP2012044158A	2012-03-01
JP2002035976A	2002-02-05
JP2001192847A	2001-07-17