Title:
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/044984
Kind Code:
A1
Abstract:
Provided are a circuit board module and an electronic device. The circuit board module comprises: a bottom plate; and one or more chip modules located on the bottom plate and connected to the bottom plate. Each chip module comprises: an adapter plate and one or more chips arranged on the adapter plate at intervals, the area of the adapter plate being smaller than that of the bottom plate. Because dense pins are arranged at the bottoms of the chips, in order to connect wires of the pins on the chips, the chips need to be mounted on the adapter plate, and the chips are connected to the bottom plate by means of the adapter plate. Compared with the condition that the bottom plate uses a high-precision plate such as a multi-layer plate or a blind hole plate and the chips are directly mounted on the high-precision plate, the cost of the circuit board module is reduced by connecting the chips to the adapter plate of a small area and then connecting the chips to the bottom plate by means of the adapter plate.
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Inventors:
ZHANG KUN (CN)
YAN DONGQING (CN)
ZHUANG KUNYU (CN)
YAN DONGQING (CN)
ZHUANG KUNYU (CN)
Application Number:
PCT/CN2022/115936
Publication Date:
March 07, 2024
Filing Date:
August 30, 2022
Export Citation:
Assignee:
AMLOGIC SHANGHAI CO LTD (CN)
International Classes:
H05K1/18; G06F1/18; H05K1/11; H05K3/00
Foreign References:
CN111315139A | 2020-06-19 | |||
CN205946363U | 2017-02-08 | |||
CN216161728U | 2022-04-01 | |||
CN210246951U | 2020-04-03 | |||
US20150016045A1 | 2015-01-15 |
Attorney, Agent or Firm:
INTEBRIGHT LLP (CN)
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