Title:
CIRCUIT BOARD, PACKAGING STRUCTURE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/246602
Kind Code:
A1
Abstract:
The present application provides a circuit board, comprising a glass substrate, circuit layers, first conductors and second conductors. The glass substrate comprises a plurality of glass dielectric layers which are stacked; there are a plurality of circuit layers which are stacked; each of the circuit layers is provided on a surface of one of the glass dielectric layers; each of the first conductors passes through the glass dielectric layer; each of the second conductors is located between two adjacent glass dielectric layers and is connected to at least one circuit layer; the circuit layers are electrically connected by means of at least one of the first conductors and the second conductors. The glass dielectric layers are beneficial to reducing signal transmission loss when the circuit board transmits signals. The present application further provides a packaging structure using the circuit board, and an electronic device using the packaging structure.
Inventors:
HAN JIANHUA (CN)
CHEN JUNLONG (CN)
CHEN XIANGYANG (CN)
CHEN JUNLONG (CN)
CHEN XIANGYANG (CN)
Application Number:
PCT/CN2023/100270
Publication Date:
December 28, 2023
Filing Date:
June 14, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K3/10
Foreign References:
| CN218450661U | 2023-02-03 | |||
| US3968193A | 1976-07-06 | |||
| CN105874593A | 2016-08-17 | |||
| CN102281712A | 2011-12-14 | |||
| CN112004325A | 2020-11-27 | |||
| CN1290121A | 2001-04-04 | |||
| CN1467169A | 2004-01-14 | |||
| DE10145190A1 | 2003-04-03 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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