CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Title:

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2023/059003

Kind Code:

A1

Abstract:

A circuit board according to an embodiment comprises an insulation layer and a circuit pattern layer arranged on the insulation layer, wherein the circuit pattern layer includes a first metal layer arranged on the insulation layer and a second metal layer arranged on the first metal layer, and the first metal layer has a thickness in the range of 1-2.5 ㎛.

Inventors:

KIM JEONG HAN (KR)
KIM YONG SUK (KR)
CHOI BYEONG KYUN (KR)

Application Number:

PCT/KR2022/014765

Publication Date:

April 13, 2023

Filing Date:

September 30, 2022

Export Citation:

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Assignee:

LG INNOTEK CO LTD (KR)

International Classes:

H05K3/38; H01L23/12; H01L23/48; H05K3/42

Foreign References:

KR20120040892A	2012-04-30
KR20170133996A	2017-12-06
KR20110078835A	2011-07-07
KR20110035177A	2011-04-06
KR20130013639A	2013-02-06

Attorney, Agent or Firm:

HAW, Yong Noke (KR)

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