Title:
CIRCUIT BOARD SOLDER PAD REPAIR METHOD
Document Type and Number:
WIPO Patent Application WO/2019/056651
Kind Code:
A1
Abstract:
A circuit board solder pad repair method is provided herein, comprising the following steps: providing a circuit board having a defective solder pad; performing a first round of polishing on the circuit board to remove the defective solder pad on the circuit board; adhering a first dry film on the circuit board, exposing and developing to obtain an opening at a location of the first round of polishing; performing a first round of electroplating on the circuit board, performing a second round of polishing on a plated layer to restore flatness at the location of the first round of polishing on the circuit board; removing the first dry film on the circuit board; adhering a second dry film on the circuit board, exposing and developing to obtain an opening of a solder pad pattern; performing a second round of electroplating on the circuit board to obtain a repaired solder pad; and removing the second dry film from the circuit board. The method can be used for repair of defective solder pads without having to scrap and re-make a circuit board.
Inventors:
QIU YONGPING (CN)
GONG LI JUN (CN)
GONG LI JUN (CN)
Application Number:
PCT/CN2017/120108
Publication Date:
March 28, 2019
Filing Date:
December 29, 2017
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
YIXING SILICON VALLEY ELECTRONICS TECH CO LTD (CN)
International Classes:
H05K3/22; H05K3/40
Foreign References:
| CN105830545A | 2016-08-03 | |||
| CN101872728A | 2010-10-27 | |||
| CN105517370A | 2016-04-20 | |||
| CN103945648A | 2014-07-23 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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