Title:
CIRCUIT FOR DIE PROTECTION, DIE, AND INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2020/177082
Kind Code:
A1
Abstract:
The present application provides a circuit for die protection, a die, and an integrated circuit, relating to the field of electronic technology, being used for protecting the die from invalid manipulation by an attacker, thereby avoiding leakage of key information from the die. The circuit comprises: a detection circuit, configured to detect a signal transmission parameter of a shielding line covering the die, the signal transmission parameter comprising at least one of a transmission impedance or a transmission delay; and a control circuit, configured to acquire the signal transmission parameter from the detection circuit, and when the signal transmission parameter does not satisfy a preset condition, triggering a protection operation for the die.
Inventors:
ZHAO QIAN (CN)
JIA BO (CN)
LIU PENGJIE (CN)
JIA BO (CN)
LIU PENGJIE (CN)
Application Number:
PCT/CN2019/077011
Publication Date:
September 10, 2020
Filing Date:
March 05, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G06K19/073
Foreign References:
| US20070121575A1 | 2007-05-31 | |||
| CN105243343A | 2016-01-13 | |||
| CN1433576A | 2003-07-30 | |||
| CN1839475A | 2006-09-27 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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